High-speed PCB design guidelines

• Termination components that may be required The definition of the signals that need high-speed design rules applied to them The mechanical dimension

High-speed printed circuit board design is a process of balancing the circuit design requirements, device technologies, and fabrication materials and methodologies, to deliver a PCB that can transfer signals between the components, with integrity. After many years of research and practice, Hitech Circuits can well meet the requirements of high-speed PCB design. We can provide you with high-quality, fast PCB design for high-speed, high-density, digital-analog hybrid, and PCB design of new processes and new technologies (such as flexible boards, HDI PCB, buried blind holes, etc.). We have a group of high-quality PCB design engineers in Shenzhen. We have rich experience in carrier-class high-speed multi-layer circuit board PCB design. We comprehensively consider timing requirements, stripline and microstrip, signal matching scheme, Signal quality, signal trace topology, power ground decoupling, high-speed signal return current return path signal impedance control and stack stackup control, single-board EMC/EMI policy analysis, blind via and buried via and so on, and from the perspective of high-speed pcb layout, use our experience to optimize your schematic design so that your board's inherent quality is higher and the operation is more stable.

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